The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2012
Filed:
Oct. 19, 2009
Shaw Wei Lee, Cupertino, CA (US);
Ein Sun NG, Pulau Pinang, MY;
Chue Siak Liu, Saratoga, CA (US);
Lee Han Meng @ Eugene Lee, Johor, MY;
Yee Kim Lee, Johor, MY;
Shaw Wei Lee, Cupertino, CA (US);
Ein Sun Ng, Pulau Pinang, MY;
Chue Siak Liu, Saratoga, CA (US);
Lee Han Meng @ Eugene Lee, Johor, MY;
Yee Kim Lee, Johor, MY;
National Semiconductor Corporation, Santa Clara, CA (US);
Abstract
Various semiconductor package arrangements and methods that improve the reliability of wire bonding a die to ground or other outside contacts are described. In one aspect, selected ground pads on the die are wire bonded to a bonding region located on the tie bar portion of the lead frame. The tie bar is connected to an exposed die attach pad that is downset from the bonding region of the tie bar. In some embodiments, the bonding region and the leads are at substantially the same elevation above the die and die attach pad. The die, bonding wires, and at least a portion of the lead frame can be encapsulated with a plastic encapsulant material while leaving a contact surface of the die attach pad exposed to facilitate electrically coupling the die attach pad to an external device.