This inventor holds 7 USPTO granted patents and 3 published patent applications. Top assignees: Texas Instruments Corporation, National Semiconductor Corporation. Active years: 2012-2021.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Muar, MY (2012 - 2014)
- Johor, MY (2012 - 2021)
Company Filing History:
5 out of 29,922 
2 out of 4,791 
Years Active: 2012-2021
Title: Lee Han Meng @ Eugene Lee: Innovator in Flip Chip Technology
Introduction
Lee Han Meng, also known as Eugene Lee, is a prominent inventor based in Johor, Malaysia. He has made significant contributions to the field of semiconductor packaging, particularly in the development of innovative methods for assembling flip chip packages. With a total of 7 patents to his name, Lee has established himself as a key figure in the industry.
Latest Patents
One of Lee's latest patents is focused on a locking dual leadframe for flip chip on leadframe packages. This invention outlines a method of assembling a flip chip on a leadframe package. The locking dual leadframe (LDLF) consists of a top metal frame portion that includes protruding features and a die pad, along with a bottom metal frame portion that has apertures positioned laterally to the die pad. The protruding features and apertures are designed to be similarly sized and alignable. In this method, a flipped integrated circuit (IC) die is mounted with its topside onto the top metal frame portion. The alignment of the top metal frame portion to the bottom metal frame portion ensures that the protruding features align with the apertures. The bottom side of the IC die is then pressed against the top surface of the bottom frame portion, allowing the protruding features to penetrate into the apertures.
Career Highlights
Lee has had a distinguished career, working with notable companies such as Texas Instruments Corporation and National Semiconductor Corporation. His experience in these leading organizations has contributed to his expertise in semiconductor technology and innovation.
Collaborations
Throughout his career, Lee has collaborated with talented individuals, including Anis Fauzi Bin Abdul Aziz and Kuan Yee Woo. These collaborations have further enhanced his work and contributions to the field.
Conclusion
Lee Han Meng @ Eugene Lee is a notable inventor whose work in flip chip technology has made a significant impact in the semiconductor industry. His innovative patents and career achievements reflect his dedication to advancing technology in this field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile