Ein Sun Ng

Title: Ein Sun Ng: Innovator in Semiconductor Packaging

Introduction

Ein Sun Ng is a notable inventor based in Penang, Malaysia. He has made significant contributions to the field of semiconductor packaging, particularly in enhancing the reliability of wire bonding processes. His innovative approach has led to advancements that benefit the semiconductor industry.

Latest Patents

Ein Sun Ng holds a patent titled "Leadframe packages having enhanced ground-bond reliability." This patent describes various semiconductor package arrangements and methods that improve the reliability of wire bonding a die to ground or other outside contacts. In one aspect, selected ground pads on the die are wire bonded to a bonding region located on the tie bar portion of the lead frame. The tie bar is connected to an exposed die attach pad that is downset from the bonding region of the tie bar. In some embodiments, the bonding region and the leads are at substantially the same elevation above the die and die attach pad. The die, bonding wires, and at least a portion of the lead frame can be encapsulated with a plastic encapsulant material while leaving a contact surface of the die attach pad exposed to facilitate electrically coupling the die attach pad to an external device.

Career Highlights

Ein Sun Ng is currently employed at National Semiconductor Corporation, where he continues to innovate in semiconductor technologies. His work has been instrumental in developing reliable packaging solutions that meet the demands of modern electronics.

Collaborations

Ein Sun Ng collaborates with talented individuals in his field, including Lee Han Meng, also known as Eugene Lee, and Shaw Wei Lee, who is a woman. These collaborations enhance the creative process and lead to groundbreaking advancements in semiconductor packaging.

Conclusion

Ein Sun Ng's contributions to semiconductor packaging through his innovative patent demonstrate his commitment to improving technology in the industry. His work continues to influence the reliability and efficiency of semiconductor devices.