Mitaka, Japan

Yasuyuki Sakaya

This inventor holds 5 USPTO granted patents. Top assignee: Tokyo Seimitsu Co., Ltd.. Active years: 2004-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yasuyuki Sakaya. Retrieved from https://idiyas.com/inventor/yasuyuki-sakaya

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 60.0

Average Co-Inventor Count = 3.0

ph-index = 3

Forward Citations = 14(Granted Patents)


Company Filing History:


Years Active: 2004-2013

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5 patents (USPTO):Explore Patents

Title: Innovations of Yasuyuki Sakaya

Introduction

Yasuyuki Sakaya is a prominent inventor based in Mitaka, Japan. He has made significant contributions to the field of laser technology and adhesive applications, holding a total of five patents. His work has advanced the efficiency and precision of various manufacturing processes.

Latest Patents

One of his latest patents is a laser dicing device. This apparatus includes a first position detecting device that identifies the position of a wafer's surface at the point where laser light is incident. Additionally, a second position detecting device anticipates the wafer's surface position. The control section of the device manages the position of the condensing point within the wafer's thickness. By scanning the laser light from the wafer's periphery inward, the control section utilizes data from the second position detecting device to adjust the condensing point's position. This innovation allows for precise control even at the wafer's edge, enabling the formation of a modified region through multi-photon absorption at specific locations inside the wafer.

Another notable patent is an expanding method and device. This invention involves an adhesive sheet that is expanded using a mechanism while a plate-like article is mounted to a frame. After the dicing process, the adhesive sheet's expanded state is maintained by an expansion maintaining device. This design ensures that the plate-like article can be conveyed without adjacent chips interfering with each other, thus preventing damage during transport.

Career Highlights

Yasuyuki Sakaya is currently employed at Tokyo Seimitsu Co., Ltd., where he continues to innovate and develop new technologies. His work has been instrumental in enhancing the capabilities of laser dicing and adhesive applications in manufacturing.

Collaborations

He collaborates with notable coworkers, including Masayuki Azuma and Yuichi Kubo, who contribute to his projects and innovations.

Conclusion

Yasuyuki Sakaya's contributions to laser technology and adhesive applications have significantly impacted the manufacturing industry. His innovative patents demonstrate his commitment to advancing technology and improving production processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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