The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2011
Filed:
Dec. 21, 2007
Yuichi Kubo, Mitaka, JP;
Masateru Osada, Mitaka, JP;
Masayuki Azuma, Mitaka, JP;
Yasuyuki Sakaya, Mitaka, JP;
Yuusuke Arai, Mitaka, JP;
Tomohiro Tamaki, Mitaka, JP;
Yuichi Kubo, Mitaka, JP;
Masateru Osada, Mitaka, JP;
Masayuki Azuma, Mitaka, JP;
Yasuyuki Sakaya, Mitaka, JP;
Yuusuke Arai, Mitaka, JP;
Tomohiro Tamaki, Mitaka, JP;
Tokyo Seimitsu Co., Ltd., Tokyo, JP;
Abstract
An adhesive sheet (S) is expanded by an expanding mechanism () with a plate-like article (W) being mounted to a frame (F) after dicing of the plate-like article (W) to increase spacings between individual chips (T), an expanded state of the adhesive sheet (S) is maintained by an expansion maintaining device (), so that the plate-like article (W) is able to be conveyed together with the frame (F) with the spacings between the chips (T) being maintained, thereby preventing adjacent chips (T) from interfering with each other during the conveyance. This allows the plate-like article (W), after the dicing, to be conveyed together with the frame (F) without edges of the adjacent chips (T) coming into contact with each other by vibration during the conveyance, thereby avoiding the causing of chipping or microcracks in the edges.