The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2013
Filed:
May. 17, 2004
Masayuki Azuma, Mitaka, JP;
Yasuyuki Sakaya, Mitaka, JP;
Masayuki Azuma, Mitaka, JP;
Yasuyuki Sakaya, Mitaka, JP;
Tokyo Seimitsu Co., Ltd., Hachioji-shi, Tokyo, JP;
Abstract
There is provided a laser dicing apparatus comprising: a first position detecting device detecting a position of the surface of a wafer at an incident point of laser light; second position detecting device detecting in advance a position of the surface of the wafer; and a control section controlling the position in the thickness direction of a condensing point inside the wafer, wherein the control section, when scanning the laser light from the outside of a periphery of the wafer to the inside of the periphery of the wafer, performs control based on data obtained with the second position detecting device detecting the position of the condensing point at the periphery of the wafer, and after scanning a predetermined distance, switches to perform control based on data obtained by the first position detecting device. Thereby, when the laser light is made incident through the surface of the wafer and scanned, the position control of the condensing point of the laser light can be performed even at the periphery of the wafer, and a modified region by multi-photon absorption can be formed at a predetermined position inside the wafer.