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For the Inventor, By the Inventor

Tokyo, Japan

Yasunori Karasawa

This inventor holds 4 USPTO granted patents and 4 published patent applications. Top assignee: Lintec Corporation. Active years: 2013-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yasunori Karasawa. Retrieved from https://idiyas.com/inventor/yasunori-karasawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 4 

% Patents Active = 75.0

Average Co-Inventor Count = 1.7

ph-index = 1

Forward Citations = 2(Granted Patents)


Location History:

  • Saitama, JP (2013)
  • Tokyo, JP (2014 - 2022)

Company Filing History:

goldMedal4 out of 665 
 
Lintec Corporation
 patents

Years Active: 2013-2025

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4 patents (USPTO):Explore Patents
1. 12247124 - Resin sheet (2025-03-11),
2. 11512200 - Resin composition, resin sheet, laminate, and semiconductor element (2022-11-29),
3. 8716401 - Semiconductor chip laminate and adhesive composition for semiconductor chip lamination (2014-05-06),
4. 8445092 - Resin sheet for circuit boards, sheet for circuit boards and circuit board displays (2013-05-21),

Title: Yasunori Karasawa: Innovator in Resin Technology

Introduction

Yasunori Karasawa is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of resin technology, holding a total of four patents. His innovative work focuses on enhancing the properties and applications of resin materials.

Latest Patents

Karasawa's latest patents include a groundbreaking resin sheet that is made using a resin composition containing a thermosetting component and a thermally conductive filler. The thermosetting component includes a maleimide resin, which allows the thermal diffusion rate of the cured resin sheet to reach 1.0×10 m/s or more. Additionally, he has developed a resin composition that contains a thermoplastic component, a thermosetting component, and an inorganic filler, with a weight-reduction temperature of 440 degrees Celsius or more.

Career Highlights

Yasunori Karasawa is currently associated with Lintec Corporation, where he continues to push the boundaries of resin technology. His work has been instrumental in advancing the applications of resin materials in various industries.

Collaborations

Throughout his career, Karasawa has collaborated with notable colleagues, including Isao Ichikawa and Tatsuo Fukuda. These partnerships have fostered innovation and contributed to the development of new technologies in the field.

Conclusion

Yasunori Karasawa's contributions to resin technology exemplify his dedication to innovation and excellence. His patents reflect a commitment to advancing material science, making a lasting impact in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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