The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2014
Filed:
Nov. 25, 2009
Applicants:
Yasunori Karasawa, Tokyo, JP;
Isao Ichikawa, Tokyo, JP;
Inventors:
Yasunori Karasawa, Tokyo, JP;
Isao Ichikawa, Tokyo, JP;
Assignee:
Lintec Corporation, , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C08L 63/02 (2006.01); C08L 63/04 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor chip laminate comprises a plurality of semiconductor chips and an adhesive layer through which the plurality of semiconductor chips are laminated, wherein the adhesive layer is composed of an adhesive composition comprising an acrylic polymer (A); an epoxy resin (B); a thermal curing agent (C); and a certain organophosphonium compound (D) as a thermal curing accelerator, and the content of the organophosphonium compound (D) relative to 100 parts by weight in total of the epoxy resin (B) and the thermal curing agent (C) is 0.001 to 15 parts by weight.