The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2025
Filed:
Jan. 15, 2021
Applicant:
Lintec Corporation, Tokyo, JP;
Inventors:
Assignee:
LINTEC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 79/08 (2006.01); C08G 8/10 (2006.01); C08G 73/12 (2006.01); C08J 5/18 (2006.01); C08K 3/22 (2006.01); C08K 3/38 (2006.01); C08K 5/3492 (2006.01); C09D 179/08 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C08L 79/08 (2013.01); C08G 8/10 (2013.01); C08G 73/127 (2013.01); C08J 5/18 (2013.01); C08K 3/22 (2013.01); C08K 3/38 (2013.01); C08K 5/3492 (2013.01); C09D 179/08 (2013.01); H01L 23/295 (2013.01); H01L 23/31 (2013.01); H05K 1/03 (2013.01); C08J 2379/08 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/385 (2013.01);
Abstract
A resin sheet is made using a resin composition containing a thermosetting component (A) and a thermally conductive filler (C). The thermosetting component (A) contains a maleimide resin. A thermal diffusion rate of the thermally cured resin sheet is 1.0×10m/s or more. When a cross section (P) of the resin sheet taken by cutting the resin sheet in a vertical direction to a surface of the resin sheet is observed in an area (P1), a condition represented by a numerical formula (F1) below is satisfied, the area (P1) being defined by a square whose sides are four times as large as a thickness of the resin sheet and including two surfaces of the resin sheet,0.25≤≤1 (F1)