Kitakatsuragi, Japan

Yasunori Chikawa

This inventor holds 21 USPTO granted patents, primarily in Semiconductor Devices. Top assignees: Sharp Kabushiki Kaisha Corporation, Sharp Kabushiki Kaishi. Active years: 1981-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yasunori Chikawa. Retrieved from https://idiyas.com/inventor/yasunori-chikawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 85.7

Average Co-Inventor Count = 3.8

ph-index = 10

Forward Citations = 307(Granted Patents)


Location History:

  • Wakayama, JP (1981)
  • Kita-Katsuragi, JP (1992 - 1995)
  • Nara, JP (1990 - 2003)
  • Kitakatsuragi-gun, JP (2002 - 2007)
  • Osaka, JP (2013)

Company Filing History:


Years Active: 1981-2013

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Areas of Expertise:
Semiconductor Device
Display Apparatus
Liquid Crystal Display
Bump Electrodes
Tape Carrier Package
Electrode Metal Pad
Flexible Printed Circuit Boards
Connection Structure
Ceramic Plate
Manufacturing Method
Active Element
Interlayer Insulating Film
21 patents (USPTO):Explore Patents

Title: Yasunori Chikawa: Innovating Semiconductor Technologies in Japan

Introduction

Yasunori Chikawa, based in Kitakatsuragi-gun, Japan, is an influential inventor in the field of semiconductor technology. With an impressive portfolio of 21 patents, Chikawa has significantly contributed to the development of advanced devices and display apparatuses, enhancing efficiency and performance in various electronic applications.

Latest Patents

Among Chikawa's latest innovations is a semiconductor device and display apparatus featuring a chip-on-film (COF) design. One notable patent describes a COF that incorporates a heat dissipating material on the back surface of an insulating film. This design includes a slit that reduces the degree of thermal expansion, effectively preventing deformation and disconnection of wiring. Another significant patent further refines this concept by specifying that as the distance to the edges of a heat-releasing member decreases, the area of the member itself increases, improving flexibility. These advancements ensure that stress from bending the COF does not concentrate at the edges, thereby preventing potential damage to the insulating film and maintaining the integrity of the bond between the COF and the display panel.

Career Highlights

Throughout his career, Yasunori Chikawa has worked with notable companies, particularly Sharp Corporation, where he has applied his expertise in semiconductor technologies. His innovative approach and dedication to research have paved the way for breakthroughs that are instrumental in the electronics industry.

Collaborations

Chikawa has collaborated with esteemed colleagues, including Naoyuki Tajima and Takamichi Maeda, fostering a dynamic environment of creativity and technological advancement. These partnerships have contributed to the successful development and refinement of several cutting-edge patents.

Conclusion

Yasunori Chikawa's contributions to semiconductor technology embody the spirit of innovation and creativity. With his impressive array of patents and collaborations, he continues to influence the landscape of electronics, ensuring that devices are more reliable, efficient, and advanced. His work not only benefits the companies he has been associated with but also sets a standard for future innovations in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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