Sharp Kabushiki Kaisha Corporation

Sharp Kabushiki Kaishi

Yasunori Chikawa

Naoyuki Tajima

Atsushi Ono

Takamichi Maeda

Katsunobu Mori

Takaaki Tsuda

Hirokazu Yoshida

Kenji Toyosawa

Motoji Shiota

Akio Inohara

Nobuhisa Sakaguchi

Nakae Nakamura

Satoru Tone

Makoto Kanda

Yoshiaki Honda

Norimitsu Nie

Yukinori Nakata

Masao Hayakawa

Tatsuya Katoh

Takuya Sugiyama

Seijirou Gyouten

Hiroyuki Nakanishi

Shigeyuki Sasaki

Shunichi Murahashi

Akiteru Rai

Kazuhiko Fukuta

Masao Kumura

Kunihiro Satou

Tomokatsu Nakagawa

Yasuhisa Yamaji

Mitsuaki Osono

Hiroshi Nishioka

Teruo Horii

Tsukasa Ohishi

Hiroaki Kitazaki

Hiroaki Tomokuni

Takaski Tsuda

A COF includes, in at least one embodiment, a heat dissipating material on a back surface of an insulating film. The heat dissipating material has a slit for reducing a degree of thermal expansion. Thus, at least one embodiment of the invention provides the COF in which deformation and disconnection of wiring are prevented.

Semiconductor device and display apparatus

In a COF of an embodiment of the present invention, the smaller distance to edges of a heat-releasing member an area of the heat-releasing member has, the larger openings the area has. Accordingly, a volume per area (an area per length) of the heat-releasing member decreases toward the edges. The arrangement improves flexibility of the COF. This prevents a stress caused by bending the COF from concentrating at the edges. This makes it possible to prevent a line on an insulating film from being broken. Also, it becomes possible to prevent an anisotropic conductive resin from coming off which is used to bond the COF with a display panel in providing the COF in a display apparatus.

This invention is to provide a liquid crystal module that enables a liquid crystal display (LCD) device to be further miniaturized. The liquid crystal module is configured to include at least two LCD devices and formed separately from each other, a first flexible substrate on which a semiconductor chip for driving the LCD devices and is mounted, and a second flexible substrate wherein signal transmission wiring is formed. One of the LCD devices and is electrically connected to the first flexible substrate, the other one of the LCD devices and is electrically connected to the second flexible substrate, and the first flexible substrate is electrically connected to the second flexible substrate.

LCD connected to additional LCD through multiple flexible printed circuit boards

A semiconductor device includes a semiconductor substrate, a plurality of electrode pads aligned on the semiconductor substrate, and a plurality of bump electrodes placed on each electrode pad, wherein the plurality of bump electrodes on the electrode pad are aligned in a direction orthogonal to a direction where the electrode pads are aligned. A manufacturing method of the semiconductor device includes the steps of patterning a photoresist which serves as a bump electrode forming use mask on the semiconductor substrate having formed thereon the electrode pads and forming a bump electrode in a perpendicular straight wall shape to be thinner than the photoresist by plating the bump electrode forming use metal to the electrode pad.

Liquid crystal display device and/or circuit substrate including bump electrodes and electrode pads

Semiconductor device with bumps on electrode pads oriented in given direction

In a COF manufactured by bonding and mounting a semiconductor element onto a wiring pattern on a lengthy tape carrier, the wiring patterns are aligned in more than one direction with respect to a direction in which the tape carrier is fed. The wiring patterns have a layout that increases a utilized area of the tape carrier (in other words, such that reduces useless areas). Consequently, the number of the tape carrier semiconductor devices manufactured out of a tape carrier of a certain length can be increased thereby saving manufacturing costs.

Tape carrier semiconductor device

A semiconductor device of the present invention has (1) an active element provided on a semiconductor substrate, (2) an interlayer insulating film formed so as to cover the active element, (3) a pad metal for an electrode pad which is provided on the interlayer insulating film, (4) a barrier metal layer which is provided on the active element with the interlayer insulating film therebetween, so that the pad metal is formed on the barrier metal layer, and (5) an insulating layer having high adherence to the barrier metal layer, the insulating layer being provided between the interlayer insulating film and the barrier metal layer. With this arrangement, the adherence between the barrier metal layer, the insulating film and the interlayer insulating film is surely improved, and even in the case where an external force is applied to the electrode pad upon bonding or after bonding, the barrier metal layer hardly comes off the part thereunder. Therefore, the breakdown of a level difference compensating film, and the exfoliation of the barrier metal layer from the interlayer insulating film can be prevented, while the semiconductor device of the area pad structure featuring lower costs, high quality, and high liability is constantly mass-produced. Besides, the yield of the semiconductor device is surely improved.

Semiconductor device having active element connected to an electrode metal pad via a barrier metal layer and interlayer insulating film

A re-wiring layer is provided on a circuit-formed surface of an IC chip, in an area other than where external lead electrodes. In the process for forming a circuit of the IC chip, the re-wiring layer is formed in a step following to a circuit forming step, and the rewiring layer formation is executed as a part of the IC chip fabrication process. The re-wiring layer is provided with first electrode pads on a chip periphery, second electrode pads at positions closer to the IC chip than the positions of the first electrode pads, and wires or traces for connecting the first electrode pads with the second electrode pads according to the 1:1 correspondence therebetween. By so doing, it is possible to provide a semiconductor device that allows the number of possible combinations of sizes of the laminated semiconductor chips to increase, while ensuring that an increase in the package cost, an increase in the thickness of the package, and deterioration of the package production efficiency can be suppressed.

Semiconductor device

A semiconductor device of the present invention has (1) an active element provided on a semiconductor substrate, (2) an interlayer insulating film formed so as to cover the active element, (3) a pad metal for an electrode pad which is provided on the interlayer insulating film, (4) a barrier metal layer which is provided on the active element with the interlayer insulating film therebetween, so that the pad metal is i formed on the barrier metal layer, and (5) an insulating layer having high adherence to the barrier metal layer, the insulating layer being provided between the interlayer insulating film and the barrier metal layer. With this arrangement, the adherence between the barrier metal layer, the insulating film and the interlayer insulating film is surely improved, even in the case where an external force is applied to the electrode pad upon bonding or after bonding, the barrier metal layer hardly comes off the part thereunder. Therefore, the breakdown of a level difference compensating film, and the exfoliation of the barrier metal layer from the interlayer insulating film can be prevented, while the semiconductor device of the area pad structure featuring lower costs, high quality, and high liability is constantly mass-produced. Besides, the yield of the semiconductor device is surely improved.

A connection structure for connecting a display module and a printed substrate is provided, which is appropriate for use in mass production of electronic devices such as a cellular phone in which, while a thin mounting is desired, many components have to be mounted on the printed substrate and the display module is required to be mounted in predetermined space on the printed substrate. The liquid crystal module is provided with a pin electrode on an external connection terminal of its COF, and fixed to a housing in a folded state with respective rear surfaces of the COF and a liquid crystal panel facing each other. A holding member for engaging the printed substrate and holding the printed substrate is formed on the housing. When the holding member engages the printed substrate, the liquid crystal module is fixed to the printed substrate, and at the same time, the pin electrode of the COF and a through hole electrode of the printed substrate are electrically connected.

Connection structure for display module and printed substrate, semiconductor device, display module, and electronic component

Semiconductor device including bump electrodes

A tape carrier package is provided, which includes: a line provided on one surface of a tape substrate; and a semiconductor chip mounted on an other surface of the tape substrate, the semiconductor chip having an electrode which is electrically connected to the line. The line extends from one end to an opposite end of the tape substrate and includes a connection where an intermediate line portion provided in a middle between the ends is electrically connected to the electrode.

Tape carrier package and display device using the same

In a semiconductor device of a tape carrier package type, the gap width between inner leads connected with a first edge side of a semiconductor chip set within a device mounting hole provided in the tape carrier is larger than the gap width between leads connected with a second edge side opposite to the first edge side of the semiconductor chip, and the gap length of device mounting hole between the first edge of the semiconductor chip and the first edge of the device mounting hole corresponding to the first edge of the semiconductor chip is smaller than the gap length between the second edge of the semiconductor chip and the second edge of the device mounting hole corresponding to the second edge of the semiconductor chip. Such structure enables an encapsulation resin to fill uniformly the device mounting hole, and the encapsulation resin after encapsulation has a shape of a designed dimension.

A liquid crystal panel module includes a liquid crystal panel and a plurality of tape carrier packages arranged along a side of the liquid crystal panel. A semiconductor element is attached to the tape carrier packages for operating the liquid crystal panel. Further, outer leads are disposed in the tape carrier packages on both sides of the semiconductor element and connected to each other between adjacent tape carrier packages. Finally, wires are disposed in the semiconductor element to electrically connect the outer leads, disposed on both sides of the semiconductor element, to each other.

Liquid crystal panel module and tape carrier package for liquid crystal

Growing community of inventors

Kitakatsuragi-gun, Japan

Yasunori Chikawa