Yasuji Hara

Title: Yasuji Hara: Innovator in Copper Foil Technology

Introduction

Yasuji Hara is a prominent inventor based in Ageo, Japan, known for his significant contributions to the field of copper foil technology. With a total of eight patents to his name, Hara has developed innovative solutions that enhance the performance of electronic components.

Latest Patents

Among his latest patents are advancements in roughened copper foil, copper-cladded laminate boards, and printed wiring boards. His roughened copper foil is designed to achieve both excellent transmission characteristics and high peel strength when utilized in copper-clad laminates or printed wiring boards. This innovative foil features a roughened surface on at least one side, with specific roughness parameters that optimize its performance. Additionally, Hara has developed an electrodeposited copper foil that exhibits high smoothness and flexibility, making it suitable for flexible substrates. This foil maintains impressive tensile strength both in its unannealed state and after undergoing annealing.

Career Highlights

Hara has worked with Mitsui Mining & Smelting Company, Ltd., where he honed his skills and contributed to various projects in the field of materials science. His work has been instrumental in advancing the technology surrounding copper foils, which are critical components in modern electronics.

Collaborations

Throughout his career, Hara has collaborated with notable colleagues such as Hisao Sakai and Makoto Dobashi. These partnerships have fostered innovation and have led to the successful development of new technologies in the industry.

Conclusion

Yasuji Hara's contributions to copper foil technology have made a significant impact on the electronics industry. His innovative patents and collaborations highlight his role as a leading inventor in this field.