Mitsui Minings & Melting Co., Ltd.

Other

Yasuji Hara

Makoto Dobashi

Hisao Sakai

Susumu Takahashi

Mitsuyoshi Matsuda

Tsutomu Asai

Toshiko Yokota

Mitsuhiro Wada

Mitsuo Suzuki

Daisuke Nakajima

Yutaka Hirasawa

Masaru Takahashi

Nobuyuki Imada

Kazuko Taniguchi

Ayumu Tateoka

Akira Uchiyama

Kazuyuki Okada

Naoya Matsushita

Yasuo Sato

Ryosuke Kaneyama

Chun Chieh Li

Provided is a roughened copper foil capable of achieving both excellent transmission characteristics and high peel strength when used for a copper-clad laminate or a printed wiring board. This roughened copper foil includes a roughened surface on at least one side. The roughened surface has a roughness slope tan θ of 0.58 or less as calculated based on a mean height Rc (μm) and a mean width RSm (μm) of profile elements by formula Rc/(0.5×RSm), and a small projected area Rc×RSm of 0.45 μmor more and 2.00 μmor less that is a product of the mean height Rc (μm) and the mean width RSm (μm) of the profile elements. Rc and RSm are values measured in accordance with JIS B0601-2013 under a condition of not performing a cutoff by a cutoff value λs and a cutoff value λc.

Roughened copper foil, copper-cladded laminate board, and printed wiring board

Provided is an electrodeposited copper foil having high smoothness and at the same time exhibiting high flexibility (particularly, high flexibility after annealing at 180° C. for 1 hour) suitable for a flexible substrate. This electrodeposited copper foil has a ten-point average roughness Rz of 0.1 μm or larger and 2.0 μm or smaller on at least one surface, has a tensile strength measured in accordance with IPC-TM-650 of 56 kgf/mmor more and less than 65 kgf/mmin an unannealed original state, and has a tensile strength measured in accordance with IPC-TM-650 of 15 kgf/mmor more and less than 25 kgf/mmafter annealing at 180° C. for 1 hour.

Electrolytic copper foil

Provided is an electrodeposited copper foil having high smoothness and exhibiting high flexibility (particularly, high flexibility after annealing at 180° C. for 1 hour) suitable for a flexible substrate. This electrodeposited copper foil has an Rz of 0.1 to 2.0 μm on at least one surface. In cross-sectional analysis by EBSD, a proportion of an area occupied by copper crystal grains satisfying the following conditions relative to an area of an observation field occupied by copper crystal grains is 63% or more. The conditions are as follows: i) (101) orientation; ii) an aspect ratio of 0.500 or less; iii) |sin θ| of 0.001 to 0.707, where θ (°) is an angle between a normal line of an electrode surface of the electrodeposited copper foil and a major axis of the copper crystal grain; and iv) when the crystal is elliptically approximated, a length of a minor axis of 0.38 μm or smaller.

There is provided a flexible printed wiring board including an insulating layer having a high optical transmittance, a high adhesion strength and a high migration resistance, and suitable for a chip on film (hereafter referred to as COF). In a flexible printed wiring board for COF, having an insulating layer on which a conductive layer of an electrodeposited copper foil is laminated, and an optical transmittance of 50% or more of the insulating layer in the etched region when a circuit is formed by etching said conductive layer, electrodeposited copper foil was made to have a rust-proofing layer of a nickel-zinc alloy on the adhering surface to be adhered to the insulating layer; the surface roughness (Rz) of the adhering surface was made to be 0.05 to 1.5 &#x3bc;m, and the specular gloss was made to be 250 or more when the incident angle is 60&#xb0;.

Flexible printed wiring board for chip-on flexibles

An object of the invention is to provide a method for continuously producing electrodeposited copper foil while thiourea-decomposed products remaining in copper electrolyte are removed through activated carbon treatment. Another object is to provide high-resistivity copper foil obtained through the method. The present invention further provides an electrodeposition apparatus including a path for circulating a copper sulfate solution, whereby in said path is provided a filtration means for removal of thiourea-decomposed products remaining in copper electrolyte.

Electrodeposition apparatus for producing electrodeposited copper foil and electrodeposited copper foil produced by the apparatus

A process for producing an electrodeposited copper foil, comprising electrodepositing a copper foil from an electrolyte containing copper sulfate dissolved therein, in which said electrolyte contains a small amount of lead (Pb) ions, which comprises adding a salt of a metal of Group IIA of the periodic table to the electrolyte in an amount of 10 to 150 mols per mol of lead (Pb) ions contained in the electrolyte so that the lead (Pb) ions contained in the electrolyte react with the metal of Group IIA of the periodic table to thereby form an insoluble composite substance to precipitate, the insoluble composite substance followed by removing it from the electrolyte and forming an electrodeposited copper foil in the electrolyte having the lead (Pb) ions removed therefrom.

Manufacturing method of electrodeposited copper foil

A high tensile strength copper foil having a matte side roughness Rz of 2.5 &mgr;m or less and a tensile strength of 40,000 Kgf/mm,after heating one hour at 180&deg; C. is produced by a process in which copper is electrodeposited from a solution containing predetermined small amounts of a polyether glycol and tin and iron ions. The chloride ion content is maintained below 0.1 wt. ppm. The copper foil is characterized by having copper crystals with atomic cells having a predominently (111) orientation.

High tensile strength electrodeposited copper foil

A high tensile strength copper foil having a matte side roughness Rz of 2.5 .mu.m or less and a tensile strength of 40,000 Kgf/mm.sup.2 after heating one hour at 180.degree. C. is produced by a process in which copper is electrodeposited from a solution containing predetermined small amounts of a polyether glycol and tin and iron ions. The chloride ion content is maintained below 0.1 wt. ppm. The copper foil is characterized by having copper crystals with atomic cells having a predominantly (111) orientation.

Growing community of inventors

Ageo, Japan

Yasuji Hara