The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2001
Filed:
Jul. 09, 1999
Applicant:
Inventors:
Hisao Sakai, Kitaadathigun, JP;
Toshiko Yokota, Ageo, JP;
Tsutomu Asai, Ageo, JP;
Susumu Takahashi, Kawagoe, JP;
Mitsuo Suzuki, Sakuda, JP;
Makoto Dobashi, Ageo, JP;
Yasuji Hara, Ageo, JP;
Assignee:
Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 ;
U.S. Cl.
CPC ...
B32B 3/00 ;
Abstract
A high tensile strength copper foil having a matte side roughness Rz of 2.5 &mgr;m or less and a tensile strength of 40,000 Kgf/mm,after heating one hour at 180° C. is produced by a process in which copper is electrodeposited from a solution containing predetermined small amounts of a polyether glycol and tin and iron ions. The chloride ion content is maintained below 0.1 wt. ppm. The copper foil is characterized by having copper crystals with atomic cells having a predominently (111) orientation.