The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2025
Filed:
Jan. 14, 2021
Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;
Daisuke Nakajima, Ageo, JP;
Yasuji Hara, Ageo, JP;
Mitsuyoshi Matsuda, Ageo, JP;
Mitsuhiro Wada, Ageo, JP;
MITSUI MINING & SMELTING CO., LTD., Tokyo, JP;
Abstract
Provided is an electrodeposited copper foil having high smoothness and at the same time exhibiting high flexibility (particularly, high flexibility after annealing at 180° C. for 1 hour) suitable for a flexible substrate. This electrodeposited copper foil has a ten-point average roughness Rz of 0.1 μm or larger and 2.0 μm or smaller on at least one surface, has a tensile strength measured in accordance with IPC-TM-650 of 56 kgf/mmor more and less than 65 kgf/mmin an unannealed original state, and has a tensile strength measured in accordance with IPC-TM-650 of 15 kgf/mmor more and less than 25 kgf/mmafter annealing at 180° C. for 1 hour.