Ageo, Japan

Daisuke Nakajima

This inventor holds 4 USPTO granted patents. Top assignee: Mitsui Minings & Melting Co., Ltd.. Active years: 2024-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Daisuke Nakajima. Retrieved from https://idiyas.com/inventor/daisuke-nakajima-dn1d4hzn

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.7

ph-index = 1


Company Filing History:


Years Active: 2024-2026

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4 patents (USPTO):Explore Patents

Title: Daisuke Nakajima: Innovator in Copper-Clad Laminate Manufacturing

Introduction

Daisuke Nakajima is a prominent inventor based in Ageo, Japan. He has made significant contributions to the field of materials science, particularly in the manufacturing of copper-clad laminates and printed wiring boards. With a total of 4 patents to his name, Nakajima's work has advanced the technology used in flexible substrates.

Latest Patents

One of Nakajima's latest patents focuses on manufacturing methods for copper-clad laminate. This innovative method involves joining a copper foil and a resin with high heat-resistant adhesion force using a fluororesin, which is a low dielectric constant thermoplastic resin. The process includes the use of a surface-treated copper foil that features a zinc-containing layer on at least one surface. The zinc-containing layer is composed of Zn and a transition element M with a melting point of 1200° C. or more. Notably, the elemental analysis of the interface between the copper foil and the zinc-containing layer reveals that the content of Zn is 10 wt % or less, with a Zn/M weight ratio ranging from 0.2 to 0.6.

Another significant patent by Nakajima is for an electrolytic copper foil. This electrodeposited copper foil is characterized by high smoothness and flexibility, particularly after annealing at 180° C. for one hour. The foil exhibits a ten-point average roughness Rz of 0.1 μm or larger and 2.0 μm or smaller on at least one surface. It also has a tensile strength of 56 kgf/mm or more in its unannealed state and 15 kgf/mm or more after annealing.

Career Highlights

Throughout his career, Daisuke Nakajima has worked with notable companies such as Mitsui Mining & Smelting Co., Ltd. and Mitsui Mining & Melting Co., Ltd. His experience in these organizations has contributed to his expertise in materials engineering and innovation.

Collaborations

Nakajima has collaborated with esteemed colleagues, including Yasuji Hara and Mitsuyoshi Matsuda. These partnerships have fostered a collaborative environment that has led to advancements in their respective fields.

Conclusion

Daisuke Nakajima's contributions to the field of

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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