The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2025
Filed:
Mar. 17, 2022
Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;
Ayumu Tateoka, Nantou, TW;
Ryosuke Kaneyama, Nantou, TW;
Yasuji Hara, Ageo, JP;
Yasuo Sato, Ageo, JP;
Shinichi Obata, Ageo, JP;
Chun Chieh Li, Nantou, TW;
MITSUI MINING & SMELTING CO., LTD., Tokyo, JP;
Abstract
Provided is a roughened copper foil capable of achieving both excellent transmission characteristics and high peel strength when used for a copper-clad laminate or a printed wiring board. This roughened copper foil includes a roughened surface on at least one side. The roughened surface has a roughness slope tan θ of 0.58 or less as calculated based on a mean height Rc (μm) and a mean width RSm (μm) of profile elements by formula Rc/(0.5×RSm), and a small projected area Rc×RSm of 0.45 μmor more and 2.00 μmor less that is a product of the mean height Rc (μm) and the mean width RSm (μm) of the profile elements. Rc and RSm are values measured in accordance with JIS B0601-2013 under a condition of not performing a cutoff by a cutoff value λs and a cutoff value λc.