Chun Chieh Li

Title: Innovations of Chun Chieh Li in Copper Foil Technology

Introduction

Chun Chieh Li is a notable inventor based in Nantou, Taiwan. He has made significant contributions to the field of materials science, particularly in the development of advanced copper foil technologies. His innovative work has led to the creation of a patent that enhances the performance of copper-clad laminates and printed wiring boards.

Latest Patents

Chun Chieh Li holds a patent for a roughened copper foil, which is designed to achieve excellent transmission characteristics and high peel strength. This invention includes a roughened surface on at least one side, with specific parameters that optimize its performance. The roughness slope tan θ is calculated to be 0.58 or less, based on the mean height Rc and mean width RSm of profile elements. The projected area of the roughened surface is also carefully defined to ensure optimal functionality in electronic applications.

Career Highlights

Chun Chieh Li is currently employed at Mitsui Mining & Smelting Company, Ltd., where he continues to innovate in the field of materials. His work has been instrumental in advancing the technology used in electronic components, making them more efficient and reliable. His dedication to research and development has positioned him as a key figure in his industry.

Collaborations

Chun Chieh Li collaborates with talented colleagues such as Ayumu Tateoka and Ryosuke Kaneyama. Together, they work on various projects that push the boundaries of material science and engineering.

Conclusion

Chun Chieh Li's contributions to copper foil technology exemplify the impact of innovative thinking in the field of electronics. His patent reflects a commitment to enhancing the performance of essential materials used in modern technology.