Company Filing History:
Years Active: 2025
Title: Yasuo Sato: Innovator in Copper Foil Technology
Introduction
Yasuo Sato is a notable inventor based in Ageo, Japan. He has made significant contributions to the field of materials science, particularly in the development of copper foil technology. His innovative work has led to the creation of a patent that enhances the performance of printed wiring boards.
Latest Patents
Yasuo Sato holds a patent for a roughened copper foil, copper-cladded laminate board, and printed wiring board. This invention provides a roughened copper foil that achieves both excellent transmission characteristics and high peel strength when used in copper-clad laminates or printed wiring boards. The roughened surface of the foil has a roughness slope tan θ of 0.58 or less, calculated based on the mean height Rc and mean width RSm of profile elements. Additionally, the projected area of the roughened surface is optimized to enhance performance.
Career Highlights
Sato is currently employed at Mitsui Mining & Smelting Company, Ltd., where he continues to innovate in the field of materials. His work has been instrumental in advancing the technology used in electronic components, particularly in improving the reliability and efficiency of printed wiring boards.
Collaborations
Yasuo Sato collaborates with talented colleagues such as Ayumu Tateoka and Ryosuke Kaneyama. Their combined expertise contributes to the ongoing development of innovative materials and technologies within their organization.
Conclusion
Yasuo Sato's contributions to copper foil technology exemplify the impact of innovation in materials science. His patent reflects a commitment to enhancing the performance of electronic components, showcasing the importance of research and development in this field.