Company Filing History:
Years Active: 2025
Title: Ryosuke Kaneyama: Innovator in Copper Foil Technology
Introduction
Ryosuke Kaneyama is a notable inventor based in Nantou, Taiwan. He has made significant contributions to the field of materials science, particularly in the development of advanced copper foil technologies. His innovative work has led to the creation of a patent that enhances the performance of printed wiring boards.
Latest Patents
Ryosuke Kaneyama holds a patent for a roughened copper foil, copper-cladded laminate board, and printed wiring board. This invention provides a roughened copper foil that achieves both excellent transmission characteristics and high peel strength when utilized in copper-clad laminates or printed wiring boards. The roughened surface of the foil features a roughness slope tan θ of 0.58 or less, calculated based on the mean height Rc and mean width RSm of profile elements. Additionally, the projected area of the roughened surface is carefully defined to optimize performance.
Career Highlights
Ryosuke Kaneyama is associated with Mitsui Mining & Smelting Company, Ltd., where he applies his expertise in materials engineering. His work has been instrumental in advancing the company's product offerings in the electronics sector. His innovative approach has garnered attention within the industry, showcasing his commitment to enhancing technology through research and development.
Collaborations
Ryosuke collaborates with talented colleagues, including Ayumu Tateoka and Yasuji Hara. Their combined efforts contribute to the innovative environment at Mitsui Mining & Smelting Company, Ltd., fostering advancements in materials technology.
Conclusion
Ryosuke Kaneyama's contributions to the field of copper foil technology exemplify the impact of innovation in materials science. His patent reflects a significant advancement that benefits the electronics industry, highlighting his role as a key inventor in this domain.