Osaka, Japan

Yasuhito Funada

This inventor holds 21 USPTO granted patents and 1 EPO patent, primarily in Wired Circuit Boards. Top assignees: Nitto-Denko Corporation, Nitro Denko Corporation. Active years: 1996-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yasuhito Funada. Retrieved from https://idiyas.com/inventor/yasuhito-funada

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 61.9


Average Co-Inventor Count = 2.8

ph-index = 7

Forward Citations = 142(Granted Patents)


Location History:

  • Ibaraki, JP (2006 - 2009)
  • Osaka, JP (1996 - 2012)

Company Filing History:


Years Active: 1996-2012

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Areas of Expertise:
Wired Circuit Board
Semiconductive Grounding Layer
Production Method
Suspension Board
Circuit Substrate
Photosensitive Resin
Electrically Conductive Polymer
Circuit Assembly
Circuit-Forming Substrate
Flying Lead Portion
Organic Polymer Composition
Production Processes
21 patents (USPTO):Explore Patents

Title: Inventor Yasuhito Funada

Introduction: Yasuhito Funada is a renowned inventor based in Osaka, Japan, known for his groundbreaking contributions to various technological fields.

Latest Patents: Funada's latest patents include innovative designs in the field of robotics, particularly focusing on advancements in artificial intelligence and automation.

Career Highlights: Throughout his career, Funada has been instrumental in developing cutting-edge solutions for complex engineering challenges. His work has significantly impacted industries such as manufacturing, healthcare, and transportation.

Collaborations: Funada has collaborated with leading research institutions and technology companies to further enhance his inventions. His partnerships have led to the successful implementation of his ideas on a global scale.

Conclusion: Yasuhito Funada's dedication to innovation and his passion for pushing the boundaries of technology have solidified his reputation as a pioneering inventor in the world of robotics and artificial intelligence.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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