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For the Inventor, By the Inventor

Osaka, Japan

Nitro Denko Corporation


USPTO Granted Patents = 1

Forward Citations = 1

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2 inventors (with patents filed for the assignee):

goldMedal Yasuhito Funada (1 out of 21 patents)

silverMedal Toshihiko Omote (1 out of 18 patents)


1 patent:

1. 6245432 - Circuit substrate, circuit-formed suspension substrate, and production methods therefor (2001-06-12),
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USPTO Data Jan 1 1976 - Sep 22 2026

1 Patents

#1,654 in Osaka

#15,713 in Japan

Osaka, JP
Osaka, Japan

Nitro Denko Corporation

Forward Citations = 1

2 inventors:

goldMedal Yasuhito Funada (1 out of 21 patents)

silverMedal Toshihiko Omote (1 out of 18 patents)

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