The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 13, 2012

Filed:

Jun. 30, 2006
Applicants:

Jun Ishii, Osaka, JP;

Yasuhito Ohwaki, Osaka, JP;

Yasuhito Funada, Osaka, JP;

Inventors:

Jun Ishii, Osaka, JP;

Yasuhito Ohwaki, Osaka, JP;

Yasuhito Funada, Osaka, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
Abstract

A wired circuit board that can provide an enhanced adhesion of a metal supporting board at a marginal portion of an opening formed in the metal supporting board with a simple structure to prevent stripping of the metal supporting board. In a suspension board with circuit, in order to reduce a transmission loss of a conductive pattern, a metal foil embedded in an insulating base layer is formed in a pattern comprising a first metal foil portion and a second metal foil portion surrounding the first metal foil portion spaced apart therefrom, and an opening is formed in the metal supporting board so that a marginal portion of the opening is located in a space between the first metal foil portion and the second metal foil portion.


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