The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2009

Filed:

Sep. 05, 2006
Applicants:

Jun Ishii, Osaka, JP;

Yasuhito Funada, Osaka, JP;

Yasunari Ooyabu, Osaka, JP;

Inventors:

Jun Ishii, Osaka, JP;

Yasuhito Funada, Osaka, JP;

Yasunari Ooyabu, Osaka, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention provides a wired circuit board that can prevent deterioration of a conductive pattern and short-circuiting of the conductive pattern. The wired circuit board is presented herein in the form of a suspension board with circuit which comprises an insulating base layer formed on a metal supporting board, a conductive pattern formed on the insulating base layer, a metal oxide layer formed on a surface of the conductive pattern and on a surface of the insulating base layer by sputtering, and an insulating cover layer, formed on the metal oxide layer, to cover the conductive pattern. According to this suspension board with circuit, since the metal oxide layer to cover the conductive pattern is formed by the sputtering, the metal oxide layer can be formed with a uniform thickness. Hence, the metal oxide layer can fully function as a barrier layer to the conductive pattern and, accordingly, deterioration of the conductive pattern and the short-circuiting of the conductive pattern can be prevented effectively.


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