Yasuhiro Usui

Title: Yasuhiro Usui: Innovator in Analysis Methods and Packaging Solutions

Introduction

Yasuhiro Usui is a prominent inventor based in Kawasaki, Japan. He has made significant contributions to the fields of analysis methods and packaging solutions, holding a total of 5 patents. His work is characterized by innovative approaches that enhance product performance and efficiency.

Latest Patents

One of Usui's latest patents is an analysis method and apparatus designed for identifying different phthalate esters. This method involves preparing a first and second specimen, where various phthalate esters, such as DEHP and DINP, adhere to predetermined base films on metal plates. By radiating electromagnetic waves on these specimens, significantly different metal reflection IR spectra are obtained, allowing for the identification of the types of phthalate esters present.

Another notable patent focuses on a packaging method, structure, and substrate for electronic parts. This invention aims to restrain the warp of a thin film substrate, thereby increasing product yield and enhancing cooling capacity when mounting high exothermic quantity LSIs. The innovative packaging structure includes a first substrate with an opening, onto which a thin film substrate is laminated. A capacitor is inserted into the opening and bonded to the thin film substrate, ensuring stability and effective connection to the LSI.

Career Highlights

Yasuhiro Usui has built a successful career at Fujitsu Corporation, where he has been instrumental in developing cutting-edge technologies. His expertise in analysis methods and packaging solutions has positioned him as a key figure in the company’s innovation efforts.

Collaborations

Throughout his career, Usui has collaborated with talented coworkers, including Kenji Fukuzono and Masateru Koide. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Yasuhiro Usui's contributions to analysis methods and packaging solutions demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the challenges in electronic parts packaging and analysis, making him a valuable asset in the field of technology.