Fujitsu Corporation

Yasuhiro Usui

Kenji Fukuzono

Takashi Kanda

Masateru Koide

Misao Umematsu

Nobuhiro Imaizumi

Kazuaki Satoh

Kiyotaka Seyama

Mitsuo Ozaki

Tomohisa Yagi

Hideki Ota

Michiko Noguchi

For an analysis method, a first specimen and a second specimen are prepared, in which different phthalate esters, for example DEHP and DINP, adhere in different states to a pair of predetermined base films, such as PVC, on metal plates. A metal reflection IR spectrum (P) and a metal reflection IR spectrum (Q) are acquired by radiating electromagnetic waves on the prepared first specimen and the second specimen respectively. Significantly different spectra are obtained for different phthalate esters, and the types of phthalate esters are identified by using such spectra.

Analysis method and analysis apparatus

A packaging method, a packaging structure and a package is substrate capable of restraining a warp of a thin film substrate, increasing a product yield, and building up a sufficient cooling capacity in the case of mounting an LSI having a high exothermic quantity. A package substrateof the invention is such that an openingis formed in a first substrate, a thin film substrate (a second substrate)is laminated on the first substrate, the openingis covered with the thin film substrate. Next, a capacitor (a first electronic part)is inserted into the openingand bonded to the thin film substrate, a resinfills an interior of the openingto a fixed or larger thickness and is hardened, the thin film substrateand the capacitorare thereby sustained by the resin, an LSI(a second electronic part) that should be connected to the capacitoris bonded to a surface, on an exposed side, of the thin film substrate, and the capacitoris connected to the LSI

Packaging method, packaging structure and package substrate for electronic parts

According to a method of making a semiconductor device, a semiconductor chip is bonded to a substrate via bumps by flip-chip bonding. Then, a sealing adhesive composition is loaded between the semiconductor chip and the substrate to provide an adhesive sealing. The sealing adhesive composition, which is capable of hardening in two stages, contains at least a first main resin ingredient, a second main resin ingredient and a hardening agent. Then, the adhesive sealing is heated for primary hardening. Then, the substrate is placed on a mother board with a solder material interposed between the substrate and the mother board. Finally, the adhesive sealing is heated for secondary hardening while the solder material is reflowed for bonding the substrate to the mother board.

Method of making a semiconductor device with adhesive sealing subjected to two-fold hardening

A method for forming bumps including the steps of forming bumps on a dummy wafer. The dummy wafer is diced into dummy chips and the bumps formed on the dummy chips are inspected. Thus only good bumps are transferred to a real chip on which circuit patterns are formed.

Method for forming bumps using dummy wafer

Growing community of inventors

Kawasaki, Japan

Yasuhiro Usui