The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2005
Filed:
Mar. 26, 2002
Tomohisa Yagi, Kawasaki, JP;
Nobuhiro Imaizumi, Kawasaki, JP;
Yasuhiro Usui, Kawasaki, JP;
Kenji Fukuzono, Kawasaki, JP;
Tomohisa Yagi, Kawasaki, JP;
Nobuhiro Imaizumi, Kawasaki, JP;
Yasuhiro Usui, Kawasaki, JP;
Kenji Fukuzono, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
According to a method of making a semiconductor device, a semiconductor chip is bonded to a substrate via bumps by flip-chip bonding. Then, a sealing adhesive composition is loaded between the semiconductor chip and the substrate to provide an adhesive sealing. The sealing adhesive composition, which is capable of hardening in two stages, contains at least a first main resin ingredient, a second main resin ingredient and a hardening agent. Then, the adhesive sealing is heated for primary hardening. Then, the substrate is placed on a mother board with a solder material interposed between the substrate and the mother board. Finally, the adhesive sealing is heated for secondary hardening while the solder material is reflowed for bonding the substrate to the mother board.