Packaging method, packaging structure and package substrate for electronic parts

Abstract

A packaging method, a packaging structure and a package is substrate capable of restraining a warp of a thin film substrate, increasing a product yield, and building up a sufficient cooling capacity in the case of mounting an LSI having a high exothermic quantity. A package substrateof the invention is such that an openingis formed in a first substrate, a thin film substrate (a second substrate)is laminated on the first substrate, the openingis covered with the thin film substrate. Next, a capacitor (a first electronic part)is inserted into the openingand bonded to the thin film substrate, a resinfills an interior of the openingto a fixed or larger thickness and is hardened, the thin film substrateand the capacitorare thereby sustained by the resin, an LSI(a second electronic part) that should be connected to the capacitoris bonded to a surface, on an exposed side, of the thin film substrate, and the capacitoris connected to the LSI