Kasugai, Japan

Yasuhiro Kawaguchi

USPTO Granted Patents = 13 

 

Average Co-Inventor Count = 2.4

ph-index = 2

Forward Citations = 6(Granted Patents)


Location History:

  • Nagoya, JP (2004 - 2005)
  • Inazawa, JP (2018)
  • Aichi, JP (2016 - 2020)
  • Kasugai, JP (2016 - 2024)

Company Filing History:


Years Active: 2004-2024

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13 patents (USPTO):Explore Patents

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Title: Yasuhiro Kawaguchi: Pioneering Innovator in Kasugai, Japan

Introduction:

Yasuhiro Kawaguchi, a passionate inventor based in Kasugai, Japan, is known for his groundbreaking work in the field of technology and innovation. With a total of 13 patents to his name, Kawaguchi has made significant contributions to the world of adhesive technology and thermal conductivity.

Latest Patents:

Among Kawaguchi's latest patents is the "Sticking body holding member," a revolutionary invention designed to minimize slack in carrier tapes without the need for excessive tension. Additionally, his "Thermally conductive sheet" utilizes a unique combination of materials to achieve exceptional thermal conductivity while maintaining a low thermal resistance.

Career Highlights:

Throughout his career, Yasuhiro Kawaguchi has worked with reputable companies such as Kitagawa Industries Co., Inc. and Seiko Epson Corporation. His innovative spirit and dedication to pushing the boundaries of technology have set him apart as a pioneer in his field.

Collaborations:

Kawaguchi has collaborated with talented individuals such as Takashi Mizuno and Toru Matsuzaki, who have contributed to the success of his projects and inventions. Their combined expertise has led to the development of cutting-edge solutions that have revolutionized the industry.

Conclusion:

In conclusion, Yasuhiro Kawaguchi's relentless pursuit of innovation and his groundbreaking inventions have solidified his position as a true pioneer in the world of technology. His work continues to inspire future generations of inventors to think creatively and push the boundaries of what is possible in the field of adhesive technology and thermal conductivity.

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