The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2020

Filed:

Jan. 27, 2017
Applicant:

Kitagawa Industries Co., Ltd., Aichi, JP;

Inventors:

Tomoyuki Suzuki, Kasugai, JP;

Yasuo Kondo, Kasugai, JP;

Takashi Mizuno, Kasugai, JP;

Yasuhiro Kawaguchi, Kasugai, JP;

Satoshi Deguchi, Kasugai, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 83/04 (2006.01); C08K 3/013 (2018.01); C08K 3/22 (2006.01); C08K 3/28 (2006.01); C08K 3/38 (2006.01); C08K 3/14 (2006.01); C08J 5/18 (2006.01); C08K 3/34 (2006.01);
U.S. Cl.
CPC ...
C08L 83/04 (2013.01); C08J 5/18 (2013.01); C08K 3/013 (2018.01); C08K 3/14 (2013.01); C08K 3/22 (2013.01); C08K 3/28 (2013.01); C08K 3/34 (2013.01); C08K 3/38 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/282 (2013.01); C08K 2003/385 (2013.01); C08K 2201/003 (2013.01); C08K 2201/016 (2013.01); C08L 2201/00 (2013.01);
Abstract

Provided is a thermally conductive member having excellent thermal resistance and insulating properties.The thermally conductive member includes a silicone resin, a thermally conductive filler having a larger particle diameter from 30 um to 100 μm, a thermally conductive filler having a smaller particle diameter of not greater than 10 um, and mica having a particle diameter of not greater than 10 um and an aspect ratio of not greater than 50. The mica is added at a ratio of from 0.9 to 11 parts by mass relative to 100 parts by mass of the silicone resin.


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