The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2018
Filed:
Apr. 21, 2016
Applicants:
Kitagawa Industries Co., Ltd., Inazawa-shi, Aichi, JP;
Tyk Corporation, Minato-ku, Tokyo, JP;
Inventors:
Yasuhiro Kawaguchi, Inazawa, JP;
Masataka Kubo, Gifu, JP;
Assignees:
Kitagawa Industries Co., Ltd., Inazawa-Shi, Aichi, JP;
TYK Corporation, Minato-Ku, Tokyo, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H05K 1/02 (2006.01); F28F 13/00 (2006.01); F28F 21/04 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); F28F 13/003 (2013.01); F28F 21/04 (2013.01); H01L 23/3733 (2013.01); H01L 2924/0002 (2013.01);
Abstract
An electronic circuit of the present invention includes: a circuit board on which an electronic component is mounted; a heat conducting sheet stacked on the electronic component; and a heat sink stacked on the heat conducting sheet. The heat sink includes a porous ceramics having a volume resistivity of 10Ohm·cm or more and a porosity of 15-50 vol %.