The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2020
Filed:
Oct. 21, 2019
Seiko Epson Corporation, Tokyo, JP;
Kitagawa Industries Co., Ltd., Inazawa-shi, Aichi, JP;
Masaaki Ito, Ina, JP;
Toshiyuki Omori, Kamiina-gun, JP;
Toru Matsuzaki, Kasugai, JP;
Yasuhiro Kawaguchi, Kasugai, JP;
Masahiro Saito, Kasugai, JP;
Kensuke Mitsuya, Kasugai, JP;
SEIKO EPSON CORPORATION, Tokyo, JP;
KITAGAWA INDUSTRIES CO., LTD., Inazawa-shi, JP;
Abstract
A printed circuit board includes a printed wiring board having a mounting surface facing a first side, an electronic element provided on the mounting surface, a heat dissipation member disposed on the first side with respect to the electronic element, and a heat conduction member disposed between the electronic element and the heat dissipation member and having a first surface facing the first side and a second surface facing a second side opposite to the first side. The heat conduction member has a high relative magnetic permeability portion and a low relative dielectric constant portion. The high relative magnetic permeability portion surrounds the low relative dielectric constant portion on at least the second surface of the heat conduction member. At least part of the low relative dielectric constant portion overlaps the electronic element in a plan view seen in a direction perpendicular to the mounting surface.