Company Filing History:
Years Active: 2013-2015
Title: The Innovative Contributions of Yaohuang Huang
Introduction
Yaohuang Huang is a prominent inventor based in Singapore, SG. He has made significant contributions to the field of semiconductor technology, holding a total of 7 patents. His work focuses on advanced circuit modules and packaging techniques that enhance the performance and efficiency of electronic devices.
Latest Patents
One of his latest patents is a circuit module with multiple submodules. This invention includes module nodes, a first submodule, a second submodule, and a conductive structure. The first submodule has a first submodule node, while the second submodule is positioned over the first submodule and has a second submodule node. The conductive structure connects the first submodule node to one of the module nodes and the second submodule node to another module node. Another notable patent involves an embedded wafer level package for 3D and package-on-package applications, along with its manufacturing method. This process includes forming a redistribution layer on a reconstituted wafer, laser drilling apertures, and positioning solder balls to create electrical connections through solder columns.
Career Highlights
Yaohuang Huang is currently employed at STMicroelectronics GmbH, where he continues to innovate in semiconductor technologies. His expertise in circuit design and packaging has positioned him as a key player in the industry.
Collaborations
He has collaborated with notable coworkers such as Yonggang Jin and Kah Wee Gan, contributing to various projects that push the boundaries of semiconductor applications.
Conclusion
Yaohuang Huang's innovative work in semiconductor technology and his impressive portfolio of patents highlight his significant impact on the industry. His contributions continue to shape the future of electronic devices and their applications.