The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2014
Filed:
Apr. 29, 2011
Applicants:
Kah Wee Gan, Muar, MY;
Yonggang Jin, Singapore, SG;
Yun Liu, Singapore, SG;
Yaohuang Huang, Singapore, SG;
Inventors:
Kah Wee Gan, Muar, MY;
Yonggang Jin, Singapore, SG;
Yun Liu, Singapore, SG;
Yaohuang Huang, Singapore, SG;
Assignee:
STMicroelectronics Pte Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/04 (2006.01);
U.S. Cl.
CPC ...
Abstract
An embedded wafer level ball grid array (eWLB) is formed by embedding a semiconductor die in a molding compound. A trench is formed in the molding compound with a laser drill. A first layer of copper is deposited on the sidewall of the trench by physical vapor deposition. A second layer of copper is then formed on the first layer of copper by an electroless process. A third layer of copper is then formed on the second layer by electroplating.