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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9171823 B1

PDFFull Text
Date of Patent:
Oct. 27, 2015

Filed:

Dec. 30, 2011

Circuit module with multiple submodules

Applicants:

Kahwee Gan, Singapore, SG;

Yaohuang Huang, Singapore, SG;

Inventors:

KahWee Gan, Singapore, SG;

Yaohuang Huang, Singapore, SG;

Assignee:

STMICROELECTRONICS PTE LTD, Singapore, SG;

Attorney:

Seed IP Law Group PLLC

Primary Examiner:

Courtney Smith

Assistant Examiner:

Zhengfu Feng

Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 23/12 (2006.01); H01L 23/053 (2006.01); H05K 1/00 (2006.01); H05K 1/11 (2006.01); H01R 43/00 (2006.01); H05K 3/30 (2006.01); H01L 25/03 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 25/03 (2013.01); H01L 23/5389 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 21/561 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/24146 (2013.01); H01L 2224/821 (2013.01); H01L 2224/8203 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06524 (2013.01); Y10T 29/49117 (2015.01); Y10T 29/49204 (2015.01);
Abstract

An embodiment of a circuit module includes module nodes, a first submodule, a second submodule, and a conductive structure. The first submodule has a first submodule node, and the second submodule is disposed over the first submodule and has a second submodule node. The conductive structure couples the first submodule node to one of the module nodes and couples the second submodule node to one of the module nodes. Another embodiment of a circuit module includes module nodes, a first submodule, a second submodule, and a conductive structure. The first submodule has first submodule nodes, and the second submodule is disposed over the first submodule and has second submodule nodes. The conductive structure couples one of the first and second submodule nodes to one of the module nodes and couples one of the first submodule nodes to one of the second submodule nodes.

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