Yang Liu

This inventor holds 28 USPTO granted patents and 4 published patent applications, primarily in Microelectronics Packaging. Top assignees: International Business Machines Corporation, Globalfoundries Inc.. Active years: 2013-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yang Liu. Retrieved from https://idiyas.com/inventor/yang-liu-gcvoayg1

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 28 (Patent Applications = 4)

% Patents Active = 60.7

Average Co-Inventor Count = 3.6

ph-index = 5

Forward Citations = 58(Granted Patents)

Location History:

Clifton Park, NY (US) (2019)
Ossining, NY (US) (2013 - 2021)
Wappingers Falls, NY (US) (2015 - 2022)
Yorktown Heights, NY (US) (2020 - 2023)

Company Filing History:

27 out of 166,409

International Business Machines Corporation

where one patent can have more than one assignee

Years Active: 2013-2026

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Areas of Expertise:

Fluid Delivery Device

Micro-Battery Packaging

Electrostatic Discharge Protection

Heterogeneous Integration

Transdermal Sensing Probes

Interactive Educational Sessions

Air-Core Inductors

CMOS Inverters

Test Probe Head

Integrated Testing

Semiconductor Fins

Behavior-Based Learning

28 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12544546 - Fluid delivery device with hydrophobic surface (2026-02-10),

2. 11791270 - Direct bonded heterogeneous integration silicon bridge (2023-10-17),

3. 11602287 - Automatically aiding individuals with developing auditory attention abilities (2023-03-14),

4. 11587896 - Transferrable pillar structure for fanout package or interconnect bridge (2023-02-21),

5. 11534585 - Fluid delivery device with hydrophobic surface (2022-12-27),

6. 11411272 - Simplified hermetic packaging of a micro-battery (2022-08-09),

7. 11362382 - Simplified hermetic packaging of a micro-battery (2022-06-14),

8. 11210968 - Behavior-based interactive educational sessions (2021-12-28),

9. 11165248 - Air gap metal tip electrostatic discharge protection (2021-11-02),

10. 11139269 - Mixed under bump metallurgy (UBM) interconnect bridge structure (2021-10-05),

11. 11133670 - Air gap metal tip electrostatic discharge protection (2021-09-28),

12. 10638945 - Transdermal sensing probes and smart patch systems using same (2020-05-05),

13. 10585119 - Integrated self-coining probe (2020-03-10),

14. 10535994 - Air gap metal tip electrostatic discharge protection (2020-01-14),

15. 10530150 - Air gap metal tip electrostatic discharge protection (2020-01-07),

Certainly! Here is the article about inventor Yang Liu:

Title: Inventor Spotlight: Yang Liu - Pioneering Innovations in Technology

Introduction:

Yang Liu, a distinguished inventor based in Ossining, NY, has made significant contributions to the field of technology with his impressive portfolio of 27 patents. His groundbreaking work has garnered recognition for its innovative approach to solving complex challenges in the industry.

Latest Patents:

One of Yang Liu's latest patents is the "Direct Bonded Heterogeneous Integration Silicon Bridge," a cutting-edge device that revolutionizes substrate integration. The device features a unique bridge design suspended in a trench, enhancing connectivity between chips with precision. Additionally, his patent on "Automatically Aiding Individuals with Developing Auditory Attention Abilities" showcases his commitment to developing solutions that enhance user experiences in audio environments.

Career Highlights:

Yang Liu has held key positions at renowned companies such as IBM and Globalfoundries Inc., where he has played a pivotal role in driving technological advancements. His expertise in semiconductor technology and integration strategies has led to the successful implementation of innovative solutions in the industry.

Collaborations:

Throughout his career, Yang Liu has collaborated with talented individuals such as Bing Dang and Steven Lorenz Wright, pooling their collective expertise to tackle complex engineering challenges. These collaborations have resulted in the development of cutting-edge technologies that have reshaped the technological landscape.

Conclusion:

Inventor Yang Liu's relentless pursuit of innovation and his passion for pushing the boundaries of technology have solidified his reputation as a visionary in the industry. His impressive patent portfolio and collaborative spirit highlight his commitment to driving impactful change through technological advancements.

If you need more information or have any specific requests, feel free to let me know!

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

4 patents pending: