Yang Guo

Title: Innovations by Yang Guo in Microelectronics

Introduction

Yang Guo is an accomplished inventor based in Chandler, AZ (US). He has made significant contributions to the field of microelectronics, holding a total of 4 patents. His work focuses on advanced packaging technologies that enhance the performance and reliability of electronic devices.

Latest Patents

One of Yang Guo's latest patents is titled "Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zone." This invention includes an electronic package that comprises a first package with a substrate, a die, a mold layer, and through mold interconnects (TMIs). The design allows for a second package to be electrically coupled to the first package, enhancing the overall functionality of the electronic assembly. The innovative use of inkjet barrier material is aimed at controlling bondline thickness, which is crucial for the reliability of microelectronic devices.

Career Highlights

Yang Guo is currently employed at Intel Corporation, where he continues to push the boundaries of microelectronics technology. His expertise in package-on-package architecture has positioned him as a key player in the development of next-generation electronic packages.

Collaborations

Throughout his career, Yang has collaborated with notable colleagues, including Elizabeth Nofen and Shripad Gokhale. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Yang Guo's contributions to microelectronics through his patents and collaborations highlight his role as a leading inventor in the industry. His work not only advances technology but also sets the stage for future innovations in electronic packaging.