Zhubei, Taiwan

Yan-Fu Lin


Average Co-Inventor Count = 5.8

ph-index = 4

Forward Citations = 108(Granted Patents)


Location History:

  • Hsinchu County, TW (2017)
  • Zhubei, TW (2014 - 2024)

Company Filing History:


Years Active: 2014-2025

Loading Chart...
10 patents (USPTO):Explore Patents

Title: Innovations of Yan-Fu Lin

Introduction

Yan-Fu Lin is a prominent inventor based in Zhubei, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 10 patents. His work focuses on enhancing the efficiency and functionality of electronic components.

Latest Patents

One of his latest patents is a fan-out package that features a main die and a dummy die positioned side-by-side. This innovative design includes a molding material formed along the sidewalls of both the main die and the dummy die. Additionally, a redistribution layer with multiple vias and conductive lines is placed over the dies, ensuring that the vias and conductive lines are electrically connected to the connectors of the main die.

Career Highlights

Yan-Fu Lin is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His expertise in packaging technology has positioned him as a key player in the development of advanced semiconductor solutions.

Collaborations

He has collaborated with notable colleagues such as Wei-Cheng Wu and Hsien-Wei Chen, contributing to various projects that push the boundaries of semiconductor technology.

Conclusion

Yan-Fu Lin's innovative work in semiconductor packaging continues to impact the industry significantly. His patents reflect a commitment to advancing technology and improving electronic component design.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…