The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2018
Filed:
May. 01, 2017
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Yan-Fu Lin, Zhubei, TW;
Chen-Hua Yu, Hsinchu, TW;
Meng-Tsan Lee, Hsinchu, TW;
Wei-Cheng Wu, Hsinchu, TW;
Hsien-Wei Chen, Hsinchu, TW;
Taiwan Semicondcutor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A method of forming a package and a package are provided. The method includes placing a main die and a dummy die side by side on a carrier substrate. The method also includes forming a molding material along sidewalls of the main die and the dummy die. The method also includes forming a redistribution layer comprising a plurality of vias and conductive lines over the main die and the dummy die, where the plurality of vias and the conductive lines are electrically connected to connectors of the main die. The method also includes removing the carrier substrate.