logo

For the Inventor, By the Inventor

Hsinchu, Taiwan

Meng-Tsan Lee

USPTO Granted Patents = 14 

Average Co-Inventor Count = 5.0

ph-index = 4

Forward Citations = 98(Granted Patents)


Company Filing History:

goldMedal14 out of 40,848 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2018-2025

Loading Chart...
14 patents (USPTO):Explore Patents
1. 12506087 - Semiconductor package with redistribution structure and manufacturing method thereof (2025-12-23),
2. 12394754 - Device and method for UBM/RDL routing (2025-08-19),
3. 12322727 - Device and method for UBM/RDL routing (2025-06-03),
4. 12224247 - Fan-out package having a main die and a dummy die (2025-02-11),
5. 11967563 - Fan-out package having a main die and a dummy die (2024-04-23),
6. 11955439 - Semiconductor package with redistribution structure and manufacturing method thereof (2024-04-09),
7. 11581268 - Semiconductor package with redistribution structure and manufacturing method thereof (2023-02-14),
8. 11195802 - Semiconductor package including shielding plate in redistribution structure, semiconductor package including conductive via in redistribution structure, and manufacturing method thereof (2021-12-07),
9. 11094641 - Fan-out package having a main die and a dummy die (2021-08-17),
10. 11031352 - Routing design of dummy metal cap and redistribution line (2021-06-08),
11. 10510674 - Fan-out package having a main die and a dummy die, and method of forming (2019-12-17),
12. 10354961 - Routing design of dummy metal cap and redistribution line (2019-07-16),
13. 10163802 - Fan-out package having a main die and a dummy die, and method of forming (2018-12-25),
14. 9972581 - Routing design of dummy metal cap and redistribution line (2018-05-15),

Title: Meng-Tsan Lee: Innovator in Semiconductor Technology

Introduction

Meng-Tsan Lee is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 13 patents. His work focuses on enhancing the efficiency and functionality of semiconductor devices.

Latest Patents

One of Meng-Tsan Lee's latest patents is titled "Device and method for UBM/RDL routing." This invention involves an under bump metallurgy (UBM) and redistribution layer (RDL) routing structure that includes an RDL formed over a die. The RDL comprises a first conductive portion and a second conductive portion, both at the same level. The first conductive portion is separated from the second by insulating material. A UBM layer is formed over the RDL, which includes a conductive UBM trace and a conductive UBM pad. The UBM trace electrically couples the first and second conductive portions of the RDL, while the UBM pad is electrically coupled to the second conductive portion. A conductive connector is formed over and electrically coupled to the UBM pad.

Career Highlights

Meng-Tsan Lee has built a successful career at Taiwan Semiconductor Manufacturing Company Limited, where he has been instrumental in developing innovative semiconductor solutions. His expertise in UBM and RDL routing has positioned him as a key figure in the industry.

Collaborations

Throughout his career, Meng-Tsan Lee has collaborated with notable colleagues, including Wei-Cheng Wu and Chen-Hua Douglas Yu. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Meng-Tsan Lee's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the field. His work continues to influence advancements in semiconductor design and manufacturing.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…