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For the Inventor, By the Inventor

Hsinchu, Taiwan

Meng-Tsan Lee

USPTO Granted Patents = 13 

Average Co-Inventor Count = 5.0

ph-index = 4

Forward Citations = 94(Granted Patents)


Company Filing History:

goldMedal13 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2018-2025

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13 patents (USPTO):
1. 12394754 - Device and method for UBM/RDL routing (2025-08-19),
2. 12322727 - Device and method for UBM/RDL routing (2025-06-03),
3. 12224247 - Fan-out package having a main die and a dummy die (2025-02-11),
4. 11967563 - Fan-out package having a main die and a dummy die (2024-04-23),
5. 11955439 - Semiconductor package with redistribution structure and manufacturing method thereof (2024-04-09),
6. 11581268 - Semiconductor package with redistribution structure and manufacturing method thereof (2023-02-14),
7. 11195802 - Semiconductor package including shielding plate in redistribution structure, semiconductor package including conductive via in redistribution structure, and manufacturing method thereof (2021-12-07),
8. 11094641 - Fan-out package having a main die and a dummy die (2021-08-17),
9. 11031352 - Routing design of dummy metal cap and redistribution line (2021-06-08),
10. 10510674 - Fan-out package having a main die and a dummy die, and method of forming (2019-12-17),
11. 10354961 - Routing design of dummy metal cap and redistribution line (2019-07-16),
12. 10163802 - Fan-out package having a main die and a dummy die, and method of forming (2018-12-25),
13. 9972581 - Routing design of dummy metal cap and redistribution line (2018-05-15),

Title: Meng-Tsan Lee: Innovator in Semiconductor Technology

Introduction

Meng-Tsan Lee is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 13 patents. His work focuses on enhancing the efficiency and functionality of semiconductor devices.

Latest Patents

One of Meng-Tsan Lee's latest patents is titled "Device and method for UBM/RDL routing." This invention involves an under bump metallurgy (UBM) and redistribution layer (RDL) routing structure that includes an RDL formed over a die. The RDL comprises a first conductive portion and a second conductive portion, both at the same level. The first conductive portion is separated from the second by insulating material. A UBM layer is formed over the RDL, which includes a conductive UBM trace and a conductive UBM pad. The UBM trace electrically couples the first and second conductive portions of the RDL, while the UBM pad is electrically coupled to the second conductive portion. A conductive connector is formed over and electrically coupled to the UBM pad.

Career Highlights

Meng-Tsan Lee has built a successful career at Taiwan Semiconductor Manufacturing Company Limited, where he has been instrumental in developing innovative semiconductor solutions. His expertise in UBM and RDL routing has positioned him as a key figure in the industry.

Collaborations

Throughout his career, Meng-Tsan Lee has collaborated with notable colleagues, including Wei-Cheng Wu and Chen-Hua Douglas Yu. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Meng-Tsan Lee's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the field. His work continues to influence advancements in semiconductor design and manufacturing.

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