Yan Ding

Title: Yan Ding: Innovator in Semiconductor Technology

Introduction

Yan Ding is a prominent inventor based in Essex Junction, VT (US), known for his contributions to semiconductor technology. With a total of three patents to his name, he has made significant advancements in the field, particularly in the fabrication of silicon-on-insulator wafers and printed circuit boards.

Latest Patents

One of Yan Ding's latest patents involves embedding semiconductor devices in silicon-on-insulator wafers connected using through silicon vias. This innovative approach enhances the fabrication process by implanting semiconductor device elements and forming shallow trench isolations on the surface of a semiconductor wafer. The process includes depositing a dielectric material layer and bonding it with another wafer, ultimately creating connections through silicon vias.

Another notable patent focuses on a broadband through printed circuit board (PCB) for millimeter wave applications. This invention features a multi-layered structure with signal and ground vias, designed to improve the performance of millimeter wave technologies. The integration of microstrip signal vias further enhances the functionality of the PCB.

Career Highlights

Throughout his career, Yan Ding has worked with leading companies in the technology sector, including GlobalFoundries Inc. and IBM. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking innovations in semiconductor technology.

Collaborations

Yan has collaborated with talented individuals such as Hanyi Ding and Vibhor Jain, who have contributed to his projects and research endeavors.

Conclusion

Yan Ding's work in semiconductor technology exemplifies the spirit of innovation and dedication to advancing the field. His patents reflect a commitment to improving manufacturing processes and enhancing electronic device performance.