The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2016

Filed:

Jan. 22, 2014
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Dana H. Brown, Essex Junction, VT (US);

Hanyi Ding, Colchester, VT (US);

Yan Ding, Essex Junction, VT (US);

John S. Ferrario, Waterbury, VT (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/46 (2006.01); H05K 1/09 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H05K 1/0298 (2013.01); H05K 1/09 (2013.01); H05K 3/4697 (2013.01); Y10T 29/49004 (2015.01);
Abstract

A broadband through printed circuit board (PCB) for millimeter wave application and methods of manufacture are disclosed. The structure includes a multiple layered body and an opening in the multiple layered body. The structure further includes at least one signal via extending through the opening. The structure further includes ground vias extending through the opening and on opposing sides of the at least one signal via. The structure further includes a ground plate above and below the opening and electrically connected to the ground vias at respective ends. The structure further includes a microstrip signal via above and below the opening and electrically connected to the at least one signal via.


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