Shanghai, China

Ya Ping Wang

This inventor holds 6 USPTO granted patents and 6 published patent applications. Top assignees: Semiconductor Manufacturing International (Beijing) Corporation, Semiconductor Manufacturing International (Shanghai) Corporation, Stats Chippac Pte. Ltd.. Active years: 2011-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ya Ping Wang. Retrieved from https://idiyas.com/inventor/ya-ping-wang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 6 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 15(Granted Patents)


Company Filing History:


Years Active: 2011-2022

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6 patents (USPTO):Explore Patents

Title: Innovations of Ya Ping Wang in Semiconductor Technology

Introduction

Ya Ping Wang is a prominent inventor based in Shanghai, China, known for his significant contributions to semiconductor technology. With a total of 6 patents, he has developed innovative methods that enhance the fabrication and packaging of semiconductor chips.

Latest Patents

One of his latest patents is focused on semiconductor chip fabrication and packaging methods. This method involves forming a semiconductor chip, providing a printed circuit board, and creating an adhesive layer that bonds the semiconductor chip to the printed circuit board. The semiconductor chip features multiple cutting tracks that intersect to enclose specific areas with corner regions. Additionally, the connection surface of the semiconductor chip is designed with conductive bumps and first openings in the corner regions. Another notable patent is the fabrication method of a packaging structure. This structure includes a base substrate with a solder pad body region and a trench region surrounding it. The packaging structure is equipped with a passivation layer that exposes both the solder pad body region and the trench region, along with a main body solder pad and bonding conductive wire.

Career Highlights

Ya Ping Wang has worked with leading companies in the semiconductor industry, including Semiconductor Manufacturing International Corporation in Shanghai and Beijing. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor technology.

Collaborations

Throughout his career, Ya Ping Wang has collaborated with talented individuals such as Li Hui Lu and Chun Chao Fei, enhancing the innovation process through teamwork and shared expertise.

Conclusion

Ya Ping Wang's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the development of advanced semiconductor solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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