Hsin-Chu, Taiwan

Ya-Jen Sheuh

USPTO Granted Patents = 3 

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2023-2025

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3 patents (USPTO):

Title: Innovations by Inventor Ya-Jen Sheuh

Introduction

Ya-Jen Sheuh is a prominent inventor based in Hsin-Chu, Taiwan. She has made significant contributions to the field of semiconductor technology, particularly in wafer bonding and chemical-mechanical planarization systems. With a total of 3 patents, her work has advanced the efficiency and performance of semiconductor manufacturing processes.

Latest Patents

One of her latest patents is focused on methods for wafer bonding. This patent discloses techniques for improving wafer bonding performance, which includes processing semiconductor substrates and bonding them together. The method involves performing at least one chemical vapor deposition (CVD) and at least one chemical mechanical polishing (CMP) before the bonding process. Another notable patent describes multi-layered windows for use in chemical-mechanical planarization systems. These windows consist of a transparent structural layer with a hydrophilic surfactant applied to enhance their functionality in CMP processes.

Career Highlights

Ya-Jen Sheuh is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. Her innovative approaches have positioned her as a key figure in her field, contributing to advancements that benefit the entire semiconductor manufacturing sector.

Collaborations

Throughout her career, Ya-Jen has collaborated with esteemed colleagues, including Ren-Dou Lee and Chien-Wei Chang. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Ya-Jen Sheuh's contributions to semiconductor technology through her patents and collaborations highlight her role as an influential inventor. Her work continues to impact the industry positively, paving the way for future advancements in semiconductor manufacturing.

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