The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2024
Filed:
Sep. 03, 2019
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Shih-Chung Chen, Hsinchu, TW;
Yi-Shao Lin, Hsinchu, TW;
Sheng-Tai Peng, Miaoli County, TW;
Ya-Jen Sheuh, Hsinchu, TW;
Hung-Lin Chen, Pingtung, TW;
Ren-Dou Lee, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/20 (2012.01); B24B 37/013 (2012.01); B24B 37/04 (2012.01); C09G 1/02 (2006.01);
U.S. Cl.
CPC ...
B24B 37/205 (2013.01); B24B 37/013 (2013.01); B24B 37/044 (2013.01); C09G 1/02 (2013.01);
Abstract
Described herein are multi-layered windows for use in chemical-mechanical planarization (CMP) systems and CMP processes. The multi-layered windows of the present disclosure include a transparent structural layer and a hydrophilic surfactant applied to at least a portion of at least one surface of the transparent structural layer. Such multi-layered windows may be in the polishing pad, the platen, or both.