Xun Xiang

Title: Xun Xiang: Innovator in Radio Frequency Module Packaging

Introduction

Xun Xiang is a prominent inventor based in Guangzhou, China. He has made significant contributions to the field of semiconductor technology, particularly in radio frequency module packaging. With a total of two patents to his name, Xun Xiang continues to push the boundaries of innovation in his field.

Latest Patents

Xun Xiang's latest patents include a "Filter Radio Frequency Module Packaging Structure and Method for Manufacturing Same." This invention discloses a filter radio frequency module packaging structure that comprises a first filter chip with a chip main body and a wall structure. The wall structure, functional surface, and substrate together define a closed cavity, or the wall structure and functional surface together define a closed cavity. An encapsulation material wraps the first filter chip, enhancing its functionality and durability.

Another notable patent is the "Chip Interconnection Package Structure and Method." This invention provides a detailed process for forming a chip interconnection package structure. It includes forming a sacrificial pattern layer on a support structure, followed by an interconnection winding pattern layer. The process also involves forming a first insulating layer and arranging multiple chips on the first insulating layer. The method culminates in the removal of the support structure and the formation of a first interconnection hole that aligns with a corresponding interconnection pin of the chip.

Career Highlights

Xun Xiang is affiliated with the Institute of Semiconductors at the Guangdong Academy of Sciences. His work at this esteemed institution has allowed him to collaborate with other talented professionals in the field. His innovative approach and dedication to research have positioned him as a key figure in semiconductor advancements.

Collaborations

Xun Xiang has worked alongside notable colleagues such as Chuan Hu and Zhitao Chen. Their collaborative efforts have contributed to the development of cutting-edge technologies in the semiconductor industry.

Conclusion

Xun Xiang's contributions to radio frequency module packaging and semiconductor technology are noteworthy. His innovative patents reflect his commitment to advancing the field and improving the functionality of electronic devices. Through his work, he continues to inspire future generations of inventors and researchers.