The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2026
Filed:
Jul. 27, 2020
Shenzhen Xiuyuan Electronic Technology Co., Ltd., Shenzhen, CN;
Yingqiang Yan, Guangzhou, CN;
Yao Wang, Guangzhou, CN;
Chuan Hu, Guangzhou, CN;
Xun Xiang, Guangzhou, CN;
Zhitao Chen, Guangzhou, CN;
Shenzhen Xiuyuan Electronic Technology Co., Ltd., Shenzhen, CN;
Abstract
Provided are a chip fine line fan-out package structure and a manufacturing method therefor. The chip fine line fan-out package structure provided and the chip fine line fan-out package structure manufactured using the manufacturing method each include an inter-chip fine wiring layer and a package wiring layer. The line width and line spacing of the inter-chip fine wiring layer are less than the line width and line spacing of the package wiring layer, and therefore, a user can choose to use different package wiring layers according to actual needs. Therefore, the chip fine line fan-out package structure and the package structure manufactured using the manufacturing method can meet the use demands of users in more scenarios.