This inventor holds 8 USPTO granted patents and 3 published patent applications. Top assignees: Guangdong University of Technology, Fujitsu Corporation, Guangdong Telecom Academy of Science and Technology. Active years: 2009-2023.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Guangdong, CN (2019)
- Guangzhou, CN (2009 - 2023)
Company Filing History:

Years Active: 2009-2023
Title: Innovations of Xun Chen in Mini/Micro Chip Technology
Introduction
Xun Chen is a prominent inventor based in Guangzhou, China, known for his significant contributions to the field of mini/micro chip technology. With a total of 8 patents, he has developed innovative solutions that enhance the efficiency and precision of chip transfer and packaging processes.
Latest Patents
Xun Chen's latest patents include a compliant mechanical system for mini/micro chip mass transfer and packaging. This system features a flexure-based continuous ejector pin mechanism that comprises a drive support plate, a mounting base, and various drive devices and flexible hinges. The design allows for improved accuracy and efficiency compared to traditional methods. Another notable patent is the flexure-based continuous ejector pin mechanism for mini/micro chip mass transfer, which also emphasizes lower costs and higher transfer quality compared to existing technologies.
Career Highlights
Throughout his career, Xun Chen has worked with reputable organizations such as Guangdong University of Technology and Fujitsu Corporation. His experience in these institutions has allowed him to refine his skills and contribute to groundbreaking advancements in chip technology.
Collaborations
Xun Chen has collaborated with talented individuals in his field, including coworkers Xin Chen and Jian Gao. Their combined expertise has fostered an environment of innovation and creativity.
Conclusion
Xun Chen's work in mini/micro chip technology showcases his dedication to advancing the field through innovative solutions. His patents reflect a commitment to improving efficiency and precision in chip transfer and packaging processes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile