Guangdong University of Technology

Other

Fujitsu Corporation

Guangdong Telecom Academy of Science and Technology

Xun Chen

Xin Chen

Jian Gao

Yun Chen

Qiang Liu

Chengqiang Cui

Dachuang Shi

Shuquan Ding

Hui Tang

Zhihang Lin

Lei Li

Hitoshi Yamada

Qian Li

Zhijun Yang

Youdun Bai

Guanxin Huang

Yuanhui Guo

Yaobin He

Junyu Long

Canguang Lin

Han Sun

Zengguang Gao

Baisheng Wu

Yangchun Li

Yixuan Bu

Hongcheng Li

Xiangyuan Luo

Shengyu Hou

Zhishen Liao

A compliant mechanical system for Mini/Micro chip mass transfer and packaging comprises a flexure-based continuous ejector pin mechanism including a drive support plate, a mounting base, first thorn die attach drive devices, second thorn die attach drive devices, first flexible hinges, second flexible hinges, and a pricking pin. The first thorn die attach drive devices and the second thorn die attach drive devices are mounted on the drive support plate. A drive end of the first thorn die attach drive device horizontally passes rightward through the first flexible hinge at a corresponding position; a drive end of the second thorn die attach drive device horizontally passes leftward through the first flexible hinge at a corresponding position; and the mounting base is hinged to the drive ends of the two thorn die attach drive devices through the second flexible hinges.

Compliant mechanical system for mini/micro chip mass transfer and packaging

A flexure-based continuous ejector pin mechanism for Mini/Micro chip mass transfer includes a first drive frame, a second drive frame, a mounting base, a first thorn die attach drive device, a second thorn die attach drive device, first flexible hinges, second flexible hinges, and a pricking pin. The second drive frame and the first drive frame are connected through the first flexible hinge. The mounting base is connected to a left side and a right side of the second drive frame through the second flexible hinges. Compared with a laser transfer technology, the flexible movable thorn die attach device has lower cost and higher accuracy; compared with a vacuum nozzle transfer technology, the flexible movable thorn die attach device has higher transfer efficiency and quality; and compared with a conventional thorn die attach device, the flexible movable thorn die attach device has higher transfer efficiency and precision.

Flexure-based continuous ejector pin mechanism for mini/micro chip mass transfer

A method and device for preparing a graphene-based polyethylene glycol phase change material. The method includes: (S1) dispersing carbon black in deionized water to form a carbon black dispersion; immersing polyurethane sponge in the carbon black dispersion; and taking out polyurethane sponge followed by drying to obtain a polyurethane sponge-carbon black combination; (S2) subjecting the polyurethane sponge-carbon black combination to a first electrical discharge machining to obtain a first intermediate; (S3) ultrasonically mixing the first intermediate, polyethylene glycol, and MgO to obtain a second intermediate; (S4) subjecting the second intermediate to a second electrical discharge machining to obtain a third intermediate; (S5) subjecting the third intermediate to acid washing to obtain a fourth intermediate, and drying the fourth intermediate; (S6) injecting polyethylene glycol into the fourth intermediate followed by stirring in a mold and drying to prepare the graphene-based polyethylene glycol phase change material.

Method and device for preparing graphene-based polyethylene glycol phase change material

This application relates to an apparatus for producing a graphene film with a thermal manipulation function. The apparatus includes a filter cup, a filter flask, a vacuum pump, a fixing clamp, and a laser. The fixing clamp is configured to clamp a first filter membrane and a second filter membrane. The laser is configured to irradiate the first filter membrane. The first filter membrane and the second filter membrane are arranged stackedly. The filter cup and the filter flask are in snap fit up and down. The first filter membrane and the second filter membrane are arranged between the filter cup and the filter flask. The vacuum pump is in communication with the filter flask. This application also provides a method for producing the graphene film with a thermal manipulation function.

Method for producing graphene film with thermal management function

The present invention also discloses a multi-DOF (Degree of Freedom) large-stroke high-precision motion platform system using the guide mechanism. A large load-bearing guide mechanism comprises: a rigid frame for generating a large-stroke displacement to realize high-speed motion; a core motion platform connected with a motion portion of a non-contact actuator, connected with the rigid frame by a primary flexible hinge group and a secondary flexible hinge group, and used for generating a small-stroke precise displacement by elastic deformation of the flexible hinge groups under driving of the actuator.

Large load-bearing guide mechanism and multi-DOF large-stroke high-precision motion platform system

A method for synchronous electroplating filling of differential vias and an electroplating device. Laser irradiation is adopted as an external energy field to assist synchronous electroplating filling of differential vias. A mask or digital maskless technology is used to precisely heat the vias with different positions and different sizes. The filling rate of different regions varies with the temperature difference, thereby realizing the synchronous electroplating filling of differential vias in one step. In the processes of immersion pre-wetting by the electroplating liquid and electroplating filling copper, the laser is used for preheating the wafer processed with vias. In these two steps, the laser needs to locally and precisely heat upper surfaces of the micro vias on the wafer through the mask corresponding to the micro vias on the wafer.

Method for synchronous electroplating filling of differential vias and electroplating device implementing same

A method for synchronous wet etching processing of differential microstructures, including the following steps: step a: performing photoetching on a processing surface of a workpiece to be processed to develop the workpiece; step b: affixing a mask to a surface opposite to the processing surface of the workpiece; step c: continuously cooling the mask; step d: placing the cooled mask and the workpiece in a wet etching device; and adding an etchant to the processing surface of the workpiece to start etching; step e: removing the mask and the workpiece from the wet etching device after the set etching time; separating the mask and the workpiece to obtain a workpiece with a etching structure. A temperature difference is formed between the pattern area to be processed and the retaining area.

Method for synchronous wet etching processing of differential microstructures

This invention provides a method and an apparatus for selecting path in a telecommunication network. In the invention, a control strategy parameter is generated based on a control strategy, and a network condition parameter is generated based on the condition of the network, a path cost for each of a plurality of candidate paths is calculated based on the control strategy parameter and the network condition parameter, then a path with the minimal path cost is selected from among the candidate paths.

Method and apparatus for path selection in telecommunication networks

Growing community of inventors

Guangzhou, China

Xun Chen