Company Filing History:
Years Active: 2025
Title: Xiumin Yao: Innovator in Copper Plate-Covered Silicon Nitride Ceramic Substrate Technologies
Introduction
Xiumin Yao is a prominent inventor based in Shanghai, China. He is renowned for his innovative work in the field of material science, particularly for developing advanced ceramic substrates with enhanced properties. With his focus on copper plate-covered silicon nitride ceramic substrates, his contributions have the potential to impact various industrial applications.
Latest Patents
Xiumin Yao holds a significant patent titled "Preparation Method for Copper Plate-Covered Silicon Nitride Ceramic Substrate." This patent details a unique preparation method that combines a silicon nitride ceramic substrate with copper sheets on both upper and lower sides. The soldering layers, which are placed between the copper sheets and the substrate, play a critical role in the assembly. The silicon nitride ceramic substrate consists of over 95 wt% silicon nitride and a grain boundary phase containing essential elements like Yttrium (Y), Magnesium (Mg), and Oxygen (O). The two-step sintering process conducted in a nitrogen atmosphere further enhances the substrate's durability and performance.
Career Highlights
Xiumin Yao is affiliated with the Chinese Academy of Sciences, where he contributes to research in advanced materials. His single patent reflects a significant advancement in ceramic substrate technology and showcases his potential to drive innovation in this field.
Collaborations
Throughout his career, Xiumin has collaborated with notable colleagues, including Xuejian Liu and Chao Li. These partnerships have likely enriched his research experience and broadened the scope of his innovative projects.
Conclusion
Xiumin Yao is a dedicated inventor whose notable work on copper plate-covered silicon nitride ceramic substrates exemplifies the intersection of creativity and scientific advancement. With his research and innovative approach, he is poised to make further contributions to the field of material science.
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